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All Wire Bonding Equipment Test & Finish Handling System Deposition Process Equipment Dispensing Equipment Surface Mount Technology Wafer Separation Encapsulation Equipment Sintering Equipment AOI/FOL Equipment Singulation, Trim & Form System CIS Equipment Die Attach Equipment LED Testing, Sorting & Taping System Factory Automation

All IC & Small Signal Discrete LED Leadframes

Transfer Molding

IDEALab 3G

For Research & Development and Pilot Productivity

Transfer Molding

IDEALmold™ 3G

Automatic Encapsulation Solution (strip / reel form substrate handling)

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