Advanced Fine Pitch Solutions

A pioneer in the ultra-fine pitch wire bonding realm, we launched the 30 µm bond pad pitch bonding capability.  Key enabling factor is ASMPT’s digital control bond head technology with advanced low impact process control features.


Wire Bonding


World’s Best Fine Pitch Bonding Capability

  • 30µm BPP
  • Bond placement: 2µm @ 3σ
  • Extensive field knowledge & reliability proven solutions for:
    • 2N wires
    • Ultra low-k, 45nm technology dies


 Enabling factors

  • Innovation in core module design
  • Extensive CAE Modelling & experimental validations