Advanced Packaging Solutions

ASMPT's complete portfolio of wafer level and panel level packaging technologies, ranges from pick & place to large format mold, stencil print, ball drop, singulation and test & finish.





WLCSP

  • RDL - ECD
  • RDL - PVD
  • Ball Drop
  • Grooving
  • Dicing
  • Inspection, Testing & Packaging




2.5D TSV Interposer

Method 1

  • Grooving & Dicing
  • 3D TSV Die Stacking for HBM
  • Wafer Level HBM DA by MR / TCB
  • Wafer Level Mold Underfill
  • Dicing
  • Substrate Level MR FC / TCB Extra Large DA

Method 2

  • Grooving & Dicing
  • Wafer Level HBM DA by MR / TCB
  • Wafer Level Mold Underfill
  • Dicing
  • Substrate Level MR FC / TCB Extra Large DA

Method 3

  • Wafer Si Interposer W/ TSV & High Density RDL
  • Wafer Level Mold Underfill
  • Dicing
  • Substrate Level MR FC / TCB Extra Large DA




HIFO | Integration of FO Platform

HIFO - Die First

  • Wafer / Panel Level AB Die Placement for FO Integration
  • Wafer / Panel Level Compression Molding
  • Wafer / Panel Level HD Fine Line Width Spacing RDL Fabrication & Fine Pitch Bumping
  • Dicing
  • Large Compound Die MR / TCB

HIFO - Die Last

  • Wafer / Panel Level HD Fine Line Width Spacing RDL Fabrication
  • Wafer / Panel Level AB Die Placement for FO Integration
  • Wafer / Panel Level Compression Molding
  • Ball Drop
  • Dicing
  • Large Compound Die MR / TCB




Embedded Si Bridge Integration

  • Panel Level High Precision Bridge Bonding into Cavity
  • Panel Level High Density Fine Line Width Spacing RDL Fabrication for Bridge & Substrate Interconnect
  • Dicing
  • Substrate Level, A & B Die, High Precision TCB for H.I.




FOWLP / FOPLP

Die First

  • Grooving & Dicing for Thin Wafer
  • Wafer / Panel Level Die Pick & Place
  • Wafer / Panel Level Molding
  • Wafer / Panel Level HD Fine Line Width Spacing RDL Fabrication
  • Ball Drop
  • Dicing
  • Inspection, Testing & Packaging

Die Last - Method 1

  • Wafer / Panel Level HD Fine Line Width Spacing RDL Fabrication
  • Wafer / Panel Level Die Pick & Place
  • Wafer / Panel Level Molding
  • Ball Drop
  • Dicing
  • Inspection, Testing & Packaging

Die Last - Method 2

  • Grooving & Dicing for Thin Wafer
  • Wafer / Panel Level Die Pick & Place
  • Wafer / Panel Level Molding
  • Ball Drop
  • Dicing
  • Inspection, Testing & Packaging