Sole leader in providing particle-controlled image sensor in-line assembly solutions
Automatic Die Bonding System (12” wafer handling)
Automatic Die Bonding System (6” wafer handling)
Automatic DI-Water Cleaning System
Automatic Lens Holder Attach System
UV Grooving System
UV Dicingᵖˡᵘˢ System
For High-end IC Applications
Automated Optical Inspection
Automatic Active Alignment System (for Automotive Camera Application)
12” Automatic Die Bonder
Automated Optical Inspection Machine (For CMOS Assembly)
A New Dimension of Wire Bonding
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