MEMs Solutions (Condenser Mic / Speaker)
Automatic Die Bonding System (12” wafer handling)
UV Grooving System
UV Dicingᵖˡᵘˢ System
Fully Automatic Turret Sorting Handler
Automatic Encapsulation Solution (strip / reel form substrate handling)
For High-end IC Applications
State of the art Time-of-Flight (ToF) 3D Sensors Testing and Calibration System
Near ZERO OR Automated Optical Inspection Machine
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