ASMPT 's various power modules solutions.
Power Module (SiC)
MOSFET / IGBT
Suitable for various applications due to it's high current density, and low power dissipation; allowing them to run efficiently.
Automatic Die Bonding System (12” wafer handling)
Automatic Soft Solder Die Bonding System
Automatic Clip Bonding System
Automatic Encapsulation Solution (strip / reel form substrate handling)
Heavy Aluminum Wire Bonding System
Automated Optical Inspection
For Low Pin Count Discrete Applications
A Sintering Innovation for Power Electronics
The Component Tacking Tool for Silver (Ag) Sintering
