Stacked dies with overhang tend to bend and twist during wire bonding process. ASMPT’s wire bonders are equipped with special hardware and software features to bond the ultra-thin over hang dies.
- Overhang capability
- Process Features
- Digital control bond head with closed-loop force feedback
- Ultra low loop trajectories < 50µm
- Built-in looping database
- Programmable focus
Bond Head
Enabling Factors for stacked die wire bonding
- Industry’s best in motion and impact control
- Intelligent zPS technology
- Lower mass and inertia
- Sub pico bonding of sensing
Low Loop
- ASMPT unique looping database allows users to load and save a set of qualified looping parameters from/to wire bonder looping library
- Field proven low loop trajectories
- Stable and consistent looping performance
- Laser Dicing
- Die Attach
- Wire Bonding
- AOI System
- Encapsulation
- Final Cure
